电子专业英文简历范文

在现实生活中有很多人所从事的工资不是自己在大学时期所学习的专业，而在众多的求职者中同样也有很多人不行从事自己专业的对口行业，这也是的`教育上的弊端之一。而在求职中相对来说对口的专业人才优势更大，那么跨专业的求职者在写个人简历的时候就可以选择技术型的个人简历，来突出自己具有的技能能力，对目标职位的作用。

有很多求职者在工作经历上因为太多次的工作，非但不能作为求职的优势，反而还是劣势。工作更换的频繁会让用人单位留下不稳定的印象，那么在的选人才的时候也不会轻易选中。这种情况下就不能按照时间的顺序来的写工作经历了，选功能型个人简历就可以有效的避免此方面的麻烦。

一般来说在个人简历中的教育背景是从最高学历，逆时序来写，比如说研究生学历，接下来是本科学历背景，然后是高中学历背景，而如果中间不是连续性的，像是专科自考获得本科学历一般不再简历中体现，那么在编写个人简历的时候，也不适合时序型，以功能性个人简历更为社会。

下面是小编和大家分享的电子专业英文简历模板，更多相关资讯请点击(ruiwen/jianli)。

Name： Hukou： Residency： Work Experience： Current Salary： Tel： E-mail：ruiwen/jianli Career Objective Desired Industry： Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification Desired Position： Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff Desired address： Shanghai ,Hongkong ,Beijing ,Taiwan ,Macao Desired Salary： Negotiable Work Experience 2006/06—Present ***Company   Industry: Electronics/Semiconductor/IC

Intel Flash Engineering Department Individual Contributor

Responsibilities：

I have been working in Intel Flash Assembly & Test Engineering

Department as an Individual Contributor since June of 2006.

Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off: The yield of year 2006 has been dramatically increased than that of year 2005. The yield of all products, consecutively meets the goal. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007. Report Directly to: Department ManagerNumber of Subordinate: 14

Reference: Bao Powel

Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.

Our efforts are paid off: The yield of year 2006 has been dramatically increased than that of year 2005. The yield of all products, consecutively meets the goal. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007. 2006/01—2006/05 Intel(Shanghai) Technology Development Ltd. Company   Industry: Electronics/Semiconductor/IC

Intel STTD-China Department Electronics Development Engineer

Responsibilities： I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer. At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time. Report Directly to: Hopman MarkNumber of Subordinate: 14

Reference: Bao Powel

Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2006.

Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle. 2005/05—2006/01 Nanyang University of Science & Technology   Industry: Electronics/Semiconductor/IC

Electronics & Electrical Engineering Department Research Fellow

Responsibilities： I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow. I majored at Gate Oxide Reliability Research in the duration. Report Directly to: Professor Pey Kin Leoh

Subordinate: 3

Reference: Patrick Low

Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.

Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself. Project Experience 2008/01—Present Assembly NPI (New Product Introduction)   Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.

Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress. 2007/01—2007/12 Marginal Electrical Boards Rescue   Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.

Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress. 2006/10—2007/05 Optimization the current Test Process Order for Flash Memory   Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.

Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement. 2006/05—2006/12 Test Yield of Flash memory Improvement   Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.

Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up. Education and Training 2005/05—2006/01 Nanyang University of Science & Technology Microelectronics Doctorate   I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration. 2004/03—2005/03 Seoul National University of Korea Microelectronics Others   I had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology. 2001/03—2004/03 Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate 1998/09—2001/03 Nanjing University of Science & Technology Material Science and Engineering Master   Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics. 1993/09—1997/07 Nanjing University of Science & Technology Material Science and Engineering Bachelor 1997/07—1998/07 Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department Professional Skills Language Skills： English: EXCELLENT

Korean:AVERAGE Computer Skills： Technology skilled 96Month

SAPunderstanding 8Month Certificate： 2000/11MCSE

1999/06CET6 Self-appraisal 7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.